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Standard Package: 5000

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Request for ADAU1860BCBZRL

ADAU1860BCBZRL

56-BUMP WAFER LEVEL CHIP SCALE P

Order Code:
CIS2249407
Manufacturer Part No:
ADAU1860BCBZRL
Manufacturer:
Package / Case:
56-UFBGA, WLCSP
Detailed Description:
Audio Interface 24 b I²C, I²S, SPI 56-WLCSP (2.98x2.68)
Technical Datasheet:
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ADAU1860BCBZRL Information

More Information
Mfr Analog Devices Inc.
Series -
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®
Product Status Active
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 56-UFBGA, WLCSP
Supplier Device Package 56-WLCSP (2.98x2.68)
Type Audio
Resolution (Bits) 24 b
Data Interface I²C, I²S, SPI
Voltage - Supply, Analog 1.7V ~ 1.98V
Voltage - Supply, Digital 0.85V ~ 1.21V
Number of ADCs / DACs 3 / 1
Sigma Delta No
S/N Ratio, ADCs / DACs (db) Typ -
Dynamic Range, ADCs / DACs (db) Typ 110 / 130
More Information
ECCN EAR99
HTSUS 8542.39.0001
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected