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RoHS Status
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Operating Temperature
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Contact Finish Thickness
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Material Flammability Rating
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Number of Rows
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Contact Layout, Typical
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Images
|
Mfr. Part#
|
Quantity
|
Availability
|
Pricing
|
RoHS Status
|
Series
|
Package
|
Product Status
|
Voltage - Supply
|
Operating Temperature
|
Mounting Type
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Package / Case
|
Supplier Device Package
|
Base Product Number
|
Interface
|
Features
|
Current Rating (Amps)
|
Applications
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Memory Type
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Memory Size
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Number of Positions
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Connector Type
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Contact Finish
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Contact Finish Thickness
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Material Flammability Rating
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Pitch
|
Number of Rows
|
Termination
|
Voltage Rating
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Number of Positions Loaded
|
Connector Style
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Connector Usage
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Number of Columns
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Contact Layout, Typical
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CONN HEADER HD 180POS PCB
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Out of stock
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ROHS3 Compliant | HDI (High Density Interconnect) | Tube | Active | 3.135V ~ 3.465V | -65°C ~ 125°C | Through Hole | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | D²PAK (TO-263) | 532436 | - | Mating Guide | - | - | DDR4 SDRAM | 1Mb (128K x 8) | 180 | Header, Male Pins | Gold | 30.0µin (0.76µm) | UL94 V-0 | 0.100" (2.54mm) | 4 | Solder | - | All | High Density (HDC, HDI, HPC) | - | - | - | |
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CONN HEADER HD 150POS PCB
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Out of stock
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RoHS non-compliant | HDI (High Density Interconnect) | Tube | Active | 3.135V ~ 3.465V | -65°C ~ 125°C | Through Hole | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | D²PAK (TO-263) | 532447 | - | Mating Guide | - | - | DDR4 SDRAM | 1Mb (128K x 8) | 150 | Header, Male Pins | Gold | 30.0µin (0.76µm) | UL94 V-0 | 0.100" (2.54mm) | 3 | Press-Fit | - | All | High Density (HDC, HDI, HPC) | - | - | - | |
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CONN HDR MULT-BEAM 33POS EDGE MT
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Out of stock
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RoHS Compliant | MULTI-BEAM XL | Bulk | Active | 3.135V ~ 3.465V | -20°C ~ 105°C | Board Edge, Through Hole, Right Angle | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | D²PAK (TO-263) | 6450130 | - | Board Lock | - | - | DDR4 SDRAM | 1Mb (128K x 8) | 33 | Header, Male Pins and Blades | Gold | 30.0µin (0.76µm) | UL94 V-0 | 0.100" (2.54mm) | 4 | Solder | - | All | Multi-Beam | - | - | 24 Signal, 9 Power |