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- Material Flammability Rating UL94 V-0 Remove This Item
- Contact Finish - Post Gold Remove This Item
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RoHS Status
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Termination
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Housing Material
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Pitch - Mating
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Contact Finish - Post
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Contact Finish Thickness - Post
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Number of Positions or Pins (Grid)
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Contact Material - Mating
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Pitch - Post
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Contact Material - Post
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Termination Post Length
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Contact Resistance
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Images
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Mfr. Part#
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Quantity
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Availability
|
Pricing
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RoHS Status
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Series
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Package
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Product Status
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Operating Temperature
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Mounting Type
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Base Product Number
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Type
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Features
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Current Rating (Amps)
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Material Flammability Rating
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Termination
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Housing Material
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Pitch - Mating
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Contact Finish - Post
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Contact Finish Thickness - Post
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Number of Positions or Pins (Grid)
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Contact Material - Mating
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Pitch - Post
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Contact Material - Post
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Termination Post Length
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Contact Resistance
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CONN IC DIP SOCKET 32POS GOLD
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Out of stock
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RoHS Compliant | 800 | Tube | Obsolete | -55°C ~ 105°C | Through Hole | 1571552 | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | UL94 V-0 | Solder | Gold | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Copper | 0.125" (3.18mm) | 10mOhm | ||
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CONN IC DIP SOCKET 40POS GOLD
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Out of stock
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RoHS Compliant | 800 | Tube | Obsolete | -55°C ~ 105°C | Through Hole | 1571586 | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | UL94 V-0 | Solder | Gold | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Copper | 0.125" (3.18mm) | 10mOhm | ||
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CONN SOCKET SIP 20POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2C | SIP | Closed Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (1 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm | |
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CONN IC DIP SOCKET 8POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2A | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm | |
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CONN IC DIP SOCKET 40POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2A | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm | |
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RIGHT SEGMEN LGA4189-4 SOCKET-P4
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Out of stock
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ROHS3 Compliant | - | Tray | Active | -25°C ~ 100°C | Surface Mount | 2324271 | LGA 4189 | Open Frame | 0.5 A | UL94 V-0 | Solder | Gold | 15.0µin (0.38µm) | Thermoplastic | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | 2092 | Copper Alloy | 0.034" (0.86mm) | Copper Alloy | - | - | |
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LEFT SEGMEN LGA4189-4 SOCKET-P4
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Out of stock
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1+
$21.71780
30+
$20.92076
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ROHS3 Compliant | - | Tray | Active | -25°C ~ 100°C | Surface Mount | 2324271 | LGA 4189 | Open Frame | 0.5 A | UL94 V-0 | Solder | Gold | 15.0µin (0.38µm) | Thermoplastic | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | 2092 | Copper Alloy | 0.034" (0.86mm) | Copper Alloy | - | - |