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- Contact Finish Thickness - Post 10.0µin (0.25µm) Remove This Item
- Number of Positions or Pins (Grid) 8 (2 x 4) Remove This Item
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Termination
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Pitch - Mating
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Contact Finish - Post
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Contact Finish Thickness - Post
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Number of Positions or Pins (Grid)
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Contact Material - Mating
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Pitch - Post
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Contact Material - Post
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Termination Post Length
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Contact Resistance
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Images
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Mfr. Part#
|
Quantity
|
Availability
|
Pricing
|
RoHS Status
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Series
|
Package
|
Product Status
|
Operating Temperature
|
Mounting Type
|
Base Product Number
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Type
|
Features
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Current Rating (Amps)
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Material Flammability Rating
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Termination
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Housing Material
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Pitch - Mating
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Contact Finish - Post
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Contact Finish Thickness - Post
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Number of Positions or Pins (Grid)
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Contact Material - Mating
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Pitch - Post
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Contact Material - Post
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Termination Post Length
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Contact Resistance
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CONN IC DIP SOCKET 8POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2A | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm |