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Type
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Features
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Current Rating (Amps)
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Termination
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Contact Finish - Mating
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Housing Material
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Contact Finish - Post
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Contact Material - Post
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CONN SOCKET PLCC 32POS TIN
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Out of stock
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RoHS Compliant | - | Tube | Active | -40°C ~ 105°C | Through Hole | 54020 | PLCC | Closed Frame | 1 A | UL94 V-0 | Solder | Tin | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | 32 (2 x 7, 2 x 9) | Copper Alloy | 0.100" (2.54mm) | Copper Alloy | 0.126" (3.20mm) | 20mOhm | |
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CONN IC DIP SOCKET 8POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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CONN IC DIP SOCKET 6POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 6 (2 x 3) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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CONN IC DIP SOCKET 18POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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28P,DIP SKT,600 CL,LDR,PB FREE
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Out of stock
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$0.33500
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199299 | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 28 (2 x 14) | Phosphor Bronze | 0.100" (2.54mm) | Nickel | 0.118" (3.00mm) | 20mOhm |
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CONN SOCKET SIP 16POS GOLD
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Out of stock
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ROHS3 Compliant | - | Bulk | Active | -55°C ~ 125°C | Through Hole | 1814655 | SIP | Closed Frame | UL94 V-0 | Solder | Gold | Flash | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | 16 (1 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.114" (2.90mm) | 10mOhm | ||
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CONN SOCKET SIP 20POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2C | SIP | Closed Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (1 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm | |
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CONN IC DIP SOCKET 8POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2A | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm | |
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CONN IC DIP SOCKET 40POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Bulk | Active | -55°C ~ 125°C | Through Hole | XR2A | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.126" (3.20mm) | 20mOhm | |
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RIGHT SEGMEN LGA4189-4 SOCKET-P4
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Out of stock
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ROHS3 Compliant | - | Tray | Active | -25°C ~ 100°C | Surface Mount | 2324271 | LGA 4189 | Open Frame | 0.5 A | UL94 V-0 | Solder | Gold | 15.0µin (0.38µm) | Thermoplastic | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | 2092 | Copper Alloy | 0.034" (0.86mm) | Copper Alloy | - | - |