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|
Quantity
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Operating Temperature
|
Mounting Type
|
Base Product Number
|
Type
|
Features
|
Current Rating (Amps)
|
Material Flammability Rating
|
Termination
|
Contact Finish - Mating
|
Contact Finish Thickness - Mating
|
Housing Material
|
Pitch - Mating
|
Contact Finish - Post
|
Contact Finish Thickness - Post
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Contact Material - Mating
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Pitch - Post
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Contact Material - Post
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Termination Post Length
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LEFT SEGMEN LGA4189-4 SOCKET-P4
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Out of stock
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1+
$21.71780
30+
$20.92076
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ROHS3 Compliant | - | Tray | Active | -25°C ~ 100°C | Surface Mount | 2324271 | LGA 4189 | Open Frame | 0.5 A | UL94 V-0 | Solder | Gold | 15.0µin (0.38µm) | Thermoplastic | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | 2092 | Copper Alloy | 0.034" (0.86mm) | Copper Alloy | - | - |
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CONN IC DIP SOCKET 14POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 14 (2 x 7) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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CONN IC DIP SOCKET 16POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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CONN IC DIP SOCKET 20POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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CONN IC DIP SOCKET 28POS TIN
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199298 | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | 0.100" (2.54mm) | Brass, Copper | 0.118" (3.00mm) | 20mOhm | |
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40P,DIP SKT,600 CL,LDR,PB FREE
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Out of stock
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RoHS Compliant | Diplomate DL | Tube | Active | -40°C ~ 105°C | Through Hole | 2199299 | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 40 (2 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Nickel | 0.118" (3.00mm) | 20mOhm | |
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CONN IC DIP SOCKET 8POS TIN
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Out of stock
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RoHS Compliant | - | Tube | Active | -55°C ~ 105°C | Through Hole | DILB8P | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Tin | 100.0µin (2.54µm) | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 8 (2 x 4) | Copper Alloy | 0.100" (2.54mm) | Copper Alloy | 0.124" (3.15mm) | 30mOhm | |
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CONN CAM SOCKET 32POS GOLD
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Out of stock
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ROHS3 Compliant | 105028 | Tape & Reel (TR) | Active | - | Surface Mount | 105028 | Camera Socket | Open Frame | UL94 V-0 | Solder | Gold | 12.0µin (0.30µm) | Thermoplastic | 0.035" (0.90mm) | Nickel | 50.0µin (1.27µm) | 32 (4 x 8) | Copper Alloy | 0.035" (0.90mm) | Copper Alloy | - | - | ||
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CONN IC DIP SOCKET 14POS GOLD
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Out of stock
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RoHS Compliant | XR2 | Tube | Active | -55°C ~ 125°C | Through Hole | XR2A | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 1 A | UL94 V-0 | Solder | Gold | 10.0µin (0.25µm) |