In stock:
54
$0.00000
Standard Package:
1
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Request for ESQT-110-02-H-D-408
ESQT-110-02-H-D-408
CONN SOCKET 20POS 0.079 GOLD PCB
Order Code:
CIS1704378
Manufacturer Part No:
ESQT-110-02-H-D-408
Manufacturer:
Detailed Description:
20 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
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ESQT-110-02-H-D-408 Information
| Mfr | Samtec Inc. |
|---|---|
| Series | ESQT |
| Package | Bulk |
| Product Status | Active |
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Through Hole |
| Base Product Number | ESQT-110 |
| Features | - |
| Current Rating (Amps) | 4.5A per Contact |
| Ingress Protection | - |
| Applications | - |
| Number of Positions | 20 |
| Connector Type | Elevated Socket |
| Material Flammability Rating | UL94 V-0 |
| Contact Type | Forked |
| Number of Rows | 2 |
| Fastening Type | Push-Pull |
| Contact Shape | Square |
| Termination | Solder |
| Contact Finish - Mating | Gold |
| Voltage Rating | - |
| Contact Material | Phosphor Bronze |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Style | Board to Board or Cable |
| Number of Positions Loaded | All |
| Pitch - Mating | 0.079" (2.00mm) |
| Row Spacing - Mating | 0.079" (2.00mm) |
| Insulation Color | Black |
| Insulation Height | 0.408" (10.36mm) |
| Contact Length - Post | 0.442" (11.23mm) |
| Contact Finish - Post | Gold |
| Mated Stacking Heights | - |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Contact Finish Thickness - Post | 3.00µin (0.076µm) |
| ECCN | EAR99 |
|---|---|
| HTSUS | 8536.69.4040 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |