Out of stock
$10.28370
Standard Package:
1
Quantity | Unit Price | |
---|---|---|
1 | $10.28370 | |
200 | $3.97979 | |
500 | $3.83993 | |
1000 | $3.77000 |
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Request for ESQT-113-02-G-D-368
ESQT-113-02-G-D-368
CONN SOCKET 26POS 0.079 GOLD PCB
Order Code:
CIS1702464
Manufacturer Part No:
ESQT-113-02-G-D-368
Manufacturer:
Detailed Description:
26 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
ESQT-113-02-G-D-368 Information
Mfr | Samtec Inc. |
---|---|
Series | ESQT |
Package | Bulk |
Product Status | Active |
Operating Temperature | -55°C ~ 125°C |
Mounting Type | Through Hole |
Base Product Number | ESQT-113 |
Features | - |
Current Rating (Amps) | 4.5A per Contact |
Ingress Protection | - |
Applications | - |
Number of Positions | 26 |
Connector Type | Elevated Socket |
Material Flammability Rating | UL94 V-0 |
Contact Type | Forked |
Number of Rows | 2 |
Fastening Type | Push-Pull |
Contact Shape | Square |
Termination | Solder |
Contact Finish - Mating | Gold |
Voltage Rating | - |
Contact Material | Phosphor Bronze |
Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
Style | Board to Board or Cable |
Number of Positions Loaded | All |
Pitch - Mating | 0.079" (2.00mm) |
Row Spacing - Mating | 0.079" (2.00mm) |
Insulation Color | Black |
Insulation Height | 0.368" (9.35mm) |
Contact Length - Post | 0.482" (12.24mm) |
Contact Finish - Post | Gold |
Mated Stacking Heights | - |
Insulation Material | Liquid Crystal Polymer (LCP) |
Contact Finish Thickness - Post | 3.00µin (0.076µm) |
ECCN | EAR99 |
---|---|
HTSUS | 8536.69.4040 |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |